ASTM-D1867:2013 Edition

$40.63

D1867-13 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

Published By	Publication Date	Number of Pages
ASTM	2013	5

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Category: ASTM

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Description

ASTM D1867-13

Withdrawn Standard: Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)

ASTM D1867

Scope

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

circuit board; copper-clad laminate; printed circuit board; printed wiring board; thermosetting laminate

ICS Code

ICS Number Code 31.180 (Printed circuits and boards)

DOI: 10.1520/D1867-13

Additional information

Standard Title	D1867-13 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
Published Code	ASTM
Publication Date	2013
Pages Count	5