ASTM-F459 2006

$35.75

F459-06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

Published By	Publication Date	Number of Pages
ASTM	2006	4

Guaranteed Safe Checkout

Categories: 29.120.20 - Connecting devices, ASTM

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 m). Note 1Common usage at the present time considers the term ‘wire bond’ to include the entire interconnection: both welds and the intervening wire span.

1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see ) to be placed under the wire.

1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for aluminum ball bonds and gold wedge or ball bonds, as aluminum wedge bonds are the most sensitive to manufacturing variations (such as bond deformation) of any wire-bond type.

1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.

1.5 A nondestructive procedure is described in Practice F 458.

1.6 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

PDF Catalog

PDF Pages	PDF Title
1	Scope Referenced Documents Terminology Summary of Test Methods Significance and Use
2	Interferences Apparatus Sampling Calibration FIG. 1
3	Procedures Calculation (for Method C) FIG. 2
4	Report Precision and Bias

Additional information

Standard Title	F459-06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Published Code	ASTM
Publication Date	2006
Pages Count	4
ICS Codes	29.120.20 - Connecting devices

Preview PDF


PDF Format	Searchable	Printable	Preview Now

ASTM-F459 2006

PDF Catalog

Related products