ASTM-F508 2002
$35.75
F508-77(2002) Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
| Published By | Publication Date | Number of Pages |
| ASTM | 2002 | 3 |
ASTM F508-77-Reapproved2002
Withdrawn Standard: Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
ASTM F508
Scope
1.1 This practice covers the writing of specifications for thick-film pastes for electronics.
1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.
1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.
Keywords
hybrid microcircuits; reliability; solderability; thick films
ICS Code
ICS Number Code 31.260 (Optoelectronics. Laser equipment)
DOI: 10.1520/F0508-77R02
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Scope Specification Form and Content |
| 2 | TABLE 1 TABLE 2 |
| 3 | Keywords |
