BS EN 60115-8-1:2015
$189.07
Fixed resistors for use in electronic equipment – Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
| Published By | Publication Date | Number of Pages |
| BSI | 2015 | 50 |
IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition: – It includes minor revisions related to tables, figures and references. – Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals. – Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules. – Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic. – Adition of a test for the immunity against electrostatic discharge. – Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests. – Addition of information relevant for the component user in his assembly process. – Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | Foreword Endorsement notice |
| 6 | English CONTENTS |
| 9 | FOREWORD |
| 11 | 0 Introduction 0.1 Scope of this blank detail specification 0.2 Function of this blank detail specification |
| 12 | 0.3 Identification of the detail specification and the resistor |
| 14 | 1 Scope 2 Normative references |
| 15 | 3 Terms and definitions 4 Characteristics and ratings 4.1 General 4.2 Dimensions Figures Figure 1 – Outline and dimensions |
| 16 | 4.3 Ratings Tables Table 1 – Styles and dimensions Table 2 – Climatic categories |
| 17 | Figure 2 – Derating curve Table 3 – Ratings |
| 18 | 4.4 Resistance range and tolerance on resistance 5 Tests and test severities Table 4 – Temperature coefficients, tolerances and resistance ranges for climatic category … / … / … |
| 19 | 5.1 Insulation resistance 5.2 Voltage proof 5.3 Variation of resistance with temperature 5.4 Short time overload |
| 20 | 5.5 Temperature rise 5.6 Solderability 5.7 Resistance to soldering heat 5.8 Rapid change of temperature Table 5 – Short time overload duration |
| 21 | 5.9 Climatic sequence 5.9.1 General 5.9.2 Climatic sequence, dry heat 5.9.3 Climatic sequence, cold 5.9.4 Climatic sequence, low air pressure |
| 22 | 5.9.5 Climatic sequence, damp heat, cyclic 5.9.6 Climatic sequence, DC load 5.9.7 Climatic sequence, final measurements 5.10 Damp heat, steady state test Table 6 – Remaining cycles of damp heat, cyclic test Table 7 – Damp heat steady state test duration |
| 23 | 5.11 Endurance at 70 C 5.12 Endurance at upper category temperature 5.13 Component solvent resistance test 5.14 Solvent resistance of marking test 5.15 Shear test |
| 24 | 5.16 Substrate bending test 5.17 Flammability 5.18 Electrostatic discharge (ESD) test Table 8 – Shear test force |
| 25 | Table 9 – ESD test voltages |
| 26 | 6 Performance requirements 6.1 Limits for change of resistance at tests 6.2 Insulation resistance Table 10 –Limits for change of resistance |
| 27 | 6.3 Variation of resistance with temperature 6.4 Temperature rise 6.5 Solderability 6.6 Flammability Table 11 – Temperature coefficients and permissible change of resistance |
| 28 | 7 Marking, packaging and ordering information 7.1 Marking of the component 7.2 Packaging 7.3 Marking of the packaging 7.4 Ordering information |
| 29 | 8 Additional information 8.1 General 8.2 Storage and transportation 8.3 Substrate for assembly 8.4 Soldering process |
| 30 | 8.5 Use of cleaning agents or solvents 8.6 Coating or potting after assembly 9 Quality assessment procedures 9.1 General 9.1.1 100 % test |
| 31 | 9.1.2 Certificate of conformity (CoC) 9.1.3 Certified test records of released lots 9.2 Qualification approval 9.3 Maintenance of a qualification approval 9.3.1 Quality conformance inspection 9.3.2 Non-conforming specimen |
| 32 | Table 12 – Test schedule for qualification approval |
| 36 | Table 13 – Test schedule for quality conformance inspection |
| 41 | Annex A (normative) 0 Ω resistors (jumper) A.1 General A.2 Characteristics and ratings A.3 Tests and test severities Table A.1 – Ratings for 0 Ω resistors |
| 42 | A.4 Performance requirements A.5 Marking, packaging and ordering information A.6 Additional information A.7 Quality assessment procedures A.7.1 Test schedule for qualification approval A.7.2 Test schedule for quality conformance inspection |
| 44 | Annex B (informative) Letter symbols and abbreviations B.1 Letter symbols |
| 45 | B.2 Abbreviations |
| 46 | Annex X (informative) Cross-reference for references to the prior revision of this specification |
| 47 | Bibliography |
