BS EN 60191-6-2:2002:2003 Edition

$86.31

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Published By	Publication Date	Number of Pages
BSI	2003	14

Guaranteed Safe Checkout

Category: BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Additional information

Status	Definitive
Pages	14
Publication Date	2003-03-04
ISBN	0 580 39260 0
Standard Number	BS EN 60191-6-2:2002, IEC 60191-6-2:2001
Title	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Identical National Standard Of	IEC 60191-6-2:2001, EN 60191-6-2 (IEC 60191-2:2001 AS), EN 60216-3 (IEC 60216-3:2002) AS
Corrects	BS EN 60191-6-2:2002
Descriptors	Semiconductor devices, Dimensions, Design, Engineering drawings, Electronic equipment and components, Drawings, Standardization, Integrated circuits, Surface mounting devices
Publisher	BSI
Committee	EPL/47

Preview PDF

BS EN 60191-6-2:2002

$86.31


PDF Format	Searchable	Printable	Preview Now