BS EN 60317-2:2012
$102.76
Specifications for particular types of winding wires – Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
Published By | Publication Date | Number of Pages |
BSI | 2012 | 16 |
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
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Grade 1B: 0,020 mm up to and including 2,000 mm;
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Grade 2B: 0,020 mm up to and including 2,000 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2008.
PDF Catalog
PDF Pages | PDF Title |
---|---|
6 | English CONTENTS |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions 3.2 General notes 3.2.1 Methods of test 3.2.2 Winding wire |
9 | 3.3 Appearance 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-through 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 2,000 mm) |
10 | 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerant 17 Solderability 17.1 Nominal conductor diameters up to and including 0,050 mm Table 1 – Resistance to abrasion |
11 | 17.2 Nominal conductor diameters over 0,050 mm up to and including 0,100 mm 17.3 Nominal conductor diameter over 0,100 mm 18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil |
12 | 18.1.2 Bond strength of a twisted coil 18.2 Solvent bonding 19 Dielectric dissipation factor Table 2 – Loads |
13 | 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test 30 Packaging |
14 | Bibliography |