BS EN 61189-5-3:2015

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Soldering paste for printed board assemblies

Published By	Publication Date	Number of Pages
BSI	2015	46

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Description

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Additional information

Status	Definitive
Pages	46
Publication Date	2015-04-30
ISBN	978 0 580 90019 8
Standard Number	BS EN 61189-5-3:2015
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Soldering paste for printed board assemblies
Identical National Standard Of	EN 61189-5-3:2015
Corrects	BS IEC 61189-5-3:2015
Descriptors	Printed circuits, Electronic equipment and components, Fluxes (materials), Printed-circuit boards, Electrical insulating materials, Mechanical testing, Visual inspection (testing), Chemical analysis and testing, Electrical testing, Dimensional measurement, Environmental testing, Soldering
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN 61189-5-3:2015

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