BS EN 62137-1-1:2007

$102.76

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint – Pull strength test

Published By	Publication Date	Number of Pages
BSI	2007	18

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Description

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Additional information

Status	Definitive
Pages	18
Publication Date	2007-10-31
ISBN	978 0 580 55335 6
Standard Number	BS EN 62137-1-1:2007
Title	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint – Pull strength test
Identical National Standard Of	IEC 62137-1-1:2007, EN 62137-1-1:2007
Descriptors	Endurance testing, Printed-circuit boards, Environmental testing, Mechanical testing, Integrated circuits, Soldered joints, Pull-out tests, Surface mounting, Surface mounting devices, Soldering, Thermal testing
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies

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BS EN 62137-1-1:2007

$102.76


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