BS EN IEC 60317-72:2020
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Specifications for particular types of winding wires – Polyester glass-fibre wound silicone resin/varnish impregnated, bare or enamelled round copper wire, temperature index 200
Published By | Publication Date | Number of Pages |
BSI | 2020 | 16 |
IEC 60317-72:2020 is available as IEC 60317-72:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60317-72: 2020 specifies the requirements of polyester glass-fibre wound silicone resin/varnish impregnated, bare, grade 1 or grade 2 enamelled round copper winding wire, temperature index 200. NOTE For this type of wire, the heat shock test is inappropriate and therefore a heat shock temperature cannot be established. Consequently, a class based on the requirements for temperature index and heat shock temperature cannot be specified. The nominal conductor diameters are specified in IEC 60317-0-10:2017, Clause 4. This second edition cancels and replaces the first edition published in 2017. The document 55/1768/CDV, circulated to the National Committees as Amendment 1, led to the publication of this new edition. This edition includes the following significant technical changes with respect to the previous edition: – modification of the title; – revision to the Scope; – revision to 3.2.2.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
8 | FOREWORD |
10 | INTRODUCTION |
11 | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions 3.2 General notes 3.2.1 Methods of test 3.2.2 Winding wire |
12 | 3.3 Appearance 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-through |
13 | 11 Resistance to abrasion 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerants 17 Solderability 18 Heat or solvent bonding 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test |
14 | 30 Packaging |
15 | Bibliography |