BS IEC 62951-7:2019
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 18 |
IEC 62951-7:2019 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra?low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen, electrical contacts, sensor films and calculation procedures. For these purposes, this document provides terms, definitions, symbols, configurations, and test methods including test conditions such as temperature, relative humidity, testing time.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | English CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions |
| 8 | 4 Test method 4.1 General 4.2 Experimental apparatus Figures Figure 1 – Experimental set-up for measuring resistance by the four-wire resistance measurement method |
| 9 | 4.3 WVTR calculation 4.4 Measurement of Ca resistance |
| 10 | 4.5 Application to flexible organic semiconductor devices Figure 2 – Four-wire resistance measurement method formeasuring resistance change |
| 11 | 4.6 Measurement of barrier performance under the bending condition Figure 3 – Experimental set-up for measuring resistance by the four-wire resistance measurement method for flexible substrate |
| 12 | 5 Test report Figure 4 – Experimental set-up for measurementof barrier performance under the bending condition |
| 14 | Annex A (informative)Sample preparation and data A.1 Sample preparation A.2 Measurement data Figure A.1 – Example of Ca sensor and its deposition procedures |
| 15 | Figure A.2 – Normalized conductance change as a function of time with linear fit |
| 16 | Bibliography |
