BS IEC 63011-2:2018:2019 Edition
$102.76
Integrated circuits. Three dimensional integrated circuits – Alignment of stacked dies having fine pitch interconnect
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 18 |
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | English CONTENTS |
| 5 | FOREWORD |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions |
| 9 | 4 Die alignment during three dimensional integration 4.1 Alignment during stacking 4.2 Alignment maintenance during die bonding Figures Figure 1 – Procedure of alignment of dies during die stacking |
| 10 | Figure 2 – Misalignment sensing and compensation by aligner Figure 3 – Adjustment for translational misalignment |
| 11 | 4.3 Alignment measurement after die stacking 5 Alignment procedure 5.1 Initial die stacking 5.2 Final alignment 5.3 Assessment of alignment Figure 4 – Final alignment of vertical interconnects betweenthe adjacent layers of dies |
| 12 | Annex A (informative)Alignment examples A.1 Alignment maintenance using capacitive coupling Figure A.1 – Capacitive coupling between two misaligned wires with different widths |
| 13 | Figure A.2 – Relative capacitance with misalign and metal width Figure A.3 – Multiple narrow wires Figure A.4 – 2-D alignment key in (top) mesh type and (bottom) conjugate X- and Y-direction detectors |
| 14 | A.2 Alignment maintenance using inductive coupling Figure A.5 – S12 roll-off with misalignment (M) for at H = 10 µm, ratio = 0,1, f = 0,01 GHz, and T = 0,5 µm Table A.1 – Alignment key dimensions |
| 15 | A.3 Alignment measurement after stacking is completed Figure A.6 – Alignment keys for inductive coupling alignment detector when the electricity in the upper die is (left) available and (right) unavailable Figure A.7 – Alignment measurement keys of (top)aligned and (below) misaligned stacking |
| 16 | Bibliography |
