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BS IEC 63055:2016

BS IEC 63055:2016

$215.11

Format for LSI-Package-Board interoperable design

Published By Publication Date Number of Pages
BSI 2016 208
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This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to asā€ LSI-Package-Boardā€ (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

PDF Catalog

PDF Pages PDF Title
4 Contents
8 Title page
10 Introduction
12 Important Notice
1. Overview
1.1 Scope
1.2 Purpose
1.3 Key characteristics of the LSI-Package-Board Format
14 1.4 Contents of this standard
2. Normative references
3. Definitions, acronyms, and abbreviations
3.1 Definitions
17 3.2 Acronyms and abbreviations
19 4. Concept of the LPB Format
4.1 Technical background
4.2 Conventional design
4.3 Common problems at the design site
20 4.4 Concept of LPB interoperable design
4.5 Value creation by LPB interoperable design
21 4.6 LPB Format
22 4.7 Summary of LPB Format files
27 5. Language basics
5.1 General
28 5.2 Typographic and syntax conventions
6. Common elements in M-Format, C-Format, and R-Format
6.1 General
29 6.2 The

element
30 6.3 The element
42 7. M-Format
7.1 M-Format file structure
7.2 The element
43 7.3 The element
47 8. C-Format
8.1 C-Format file structure
48 8.2 The element
93 8.3 The element
97 9. R-Format
9.1 R-Format file structure
9.2 The element
127 9.3 The element
133 10. N-Format
10.1 Purpose of the N-Format file
10.2 How to identify the power/ground network
10.3 Example
11. G-Format
11.1 Language basics of G-Format
134 11.2 Structure
135 11.3 Header section
136 11.4 Material section
137 11.5 Layer section
11.6 Shape section
142 11.7 Board geometry section
144 11.8 Padstack section
145 11.9 Part section
146 11.10 Component section
147 11.11 Net attribute section
11.12 Netlist section
149 11.13 Via section
150 11.14 Bondwire section
152 11.15 Route section
156 Annex A (informative) Bibliography
157 Annex B (informative) Examples of utilization
B.1 Understanding the function of the LPB Format
B.2 Test bench
159 B.3 Design flow example
190 B.4 Growth of the sample files in the LPB Format
193 B.5 Simulations using the sample files in the LPB Format
195 Annex C (informative) XML Encryption
198 Annex D (informative) MD5 checksum
199 Annex E (informative) Chip-Package Interface Protocol
E.1 General
E.2 Comparison of C-Format with Chip-Package Interface Protocol

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BS IEC 63055:2016
$215.11