BSI 20/30400273 DC 2020
$13.70
BS EN IEC 60691. Thermal-links. Requirements and application guide
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 43 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 9 | 1 Scope 2 Normative references |
| 10 | 3 Terms and definitions |
| 12 | 4 General requirements 5 General notes on tests |
| 14 | 6 Classification 6.1 Electrical conditions |
| 15 | 6.2 Thermal conditions 6.3 Resistance to tracking 7 Marking |
| 16 | 8 Documentation 9 Constructional requirements 9.1 General |
| 17 | 9.2 Lead secureness tests 9.2.1 General 9.2.2 Tensile test 9.2.3 Thrust test 9.2.4 Bending/twist test |
| 18 | 9.3 Contacts used for the current path 9.4 Accessible mounting brackets or metal parts |
| 19 | 9.5 Insulating materials 9.6 Resistance to tracking 9.7 Creepage distances and clearances |
| 20 | 9.8 Temperature and humidity cycle conditioning 9.9 Terminals and terminations 10 Electrical requirements 10.1 Dielectric strength |
| 21 | 10.2 Insulation resistance 10.3 Interrupting current 10.3.1 General 10.3.2 Specific conditions 10.3.2.1 Any noncurrent-carrying metal part that is an inherent part of the thermal assembly and that may be bonded electrically to a normally-earthed exposed part of the end-product shall be connected through a quick acting and high breaking 1 A fuse… |
| 22 | 10.3.2.2 For a thermal-link having an exposed element, a metal screen shall be located 12,7 mm away from live parts. The screen shall be connected to the opposite pole of the test circuit through a quick acting and high breaking 1 A fuse (see IEC 6012… 10.3.2.3 Based on the intended use of a thermal-link, the screen may be located at a distance other than 12,7 mm if acceptable to both the manufacturer and the end user. 10.3.2.4 The test circuit shall have an open circuit voltage within 1,1 to 1,155 times the rated voltage of the thermal-link to be tested. This tolerance may be exceeded with the manufacture’s consent. The closed circuit voltage of the test circuit wh… 10.3.2.5 The tolerance of the test current shall be within 2,5 % of the specified test current. 10.3.2.6 If a thermal-link has the same current rating at more than one voltage, a test at the highest voltage is considered to be representative of tests at the lower voltages. 10.3.2.7 If a thermal-link has more than one voltage rating within a specific power factor group, the tests shall cover the conditions of maximum voltage, power, and current. One test may cover two of these conditions. 10.3.2.8 For thermal-links assigned a pilot duty rating, the test load shall consist of an electromagnet representative of the magnet coil load that the thermal-link is intended to control. The test current shall be the normal current which shall be d… 10.3.2.9 Compliance is checked by the following test. 10.3.2.10 The oven temperature may be monitored by means of a thermocouple attached to an identical but non-functioning thermal-link mounted adjacent to the samples under test. 10.3.2.11 A thermal-link that is rated for controlling an alternating-current motor is acceptable for alternating current pilot duty without further interrupting current tests if, during the original interrupting current test, the power factor was 0,5… 10.3.2.12 There shall be no damage to the integral leads of a thermal-link. There shall be no emission of hazardous substances from a thermal-link. The case of an enclosed element shall remain intact. The quick acting and high breaking 1 A fuse (see I… |
| 23 | 10.3.2.13 After these tests, the insulation resistance shall comply with the requirements of 10.2. 10.4 Transient overload current 10.5 Limited short-circuit test 10.5.1 General 10.5.1.1 When declared by a manufacturer, a thermal-link is tested as described in 10.5.2 and 10.5.3. 10.5.1.2 If the limited short-circuit test is conducted on the thermal-link itself with acceptable results, the test need not be repeated during the investigation of the end-product. 10.5.2 Test method 10.5.2.1 Three samples of the thermal-link shall be subjected to a limited short-circuit test. 10.5.2.2 The test shall be conducted at a voltage within (5 % tolerance of the rated voltage Ur. 10.5.2.3 The thermal-link shall be connected in series with a non-renewable fuse properly selected for the application in accordance with 10.5.3. The circuit shall limit the current to the applicable value specified in Table 6, measured without the th… 10.5.2.4 The power factor of the circuit shall be 0,9 to 1,0, unless a lower power factor is acceptable to both the manufacturer and the end user. 10.5.2.5 The thermal-link shall be connected in the circuit by two 915 mm lengths of copper wire having a cross-sectional area as indicated in Table 6 of IEC 60730-1:2013. Cotton shall surround the thermal-link, or a metal screen located 50 mm away – … 10.5.2.6 Each thermal-link shall be subjected to one test. |
| 24 | 10.5.3 Fuse size (rating) 10.5.4 Compliance 11 Temperature tests 11.1 General |
| 25 | 11.2 Holding temperature, Th 11.3 Rated functioning temperature, Tf 11.4 Maximum temperature limit, Tm 11.5 Ageing |
| 26 | 11.5.4.1 Step 1If requested by the manufacturer, the specimens are subjected to a temperature chosen between Tf ( 15 K and Th for a period of three weeks. At the conclusion of the test, at least 50 % of the specimens shall not have functioned. 11.5.4.2 The following tests are mandatory: 12 Resistance to rusting 13 Manufacturer’s validation programme |
| 27 | Annex A (normative) Application guide |
| 28 | Annex B (normative) Alternative ageing test for thermal-links with Th greater than 250 C for use in electric irons |
| 29 | Annex C (normative) Conductive heat ageing test C.1 Conductive heat ageing test C.2 Method C.2.1 General C.2.2 Typical test fixture assembly C.2.3 Temperature setting C.2.4 Temperature behaviour C.2.5 Temperature monitoring |
| 30 | C.3 Ageing C.3.1 General C.3.2 Cooling operation C.3.3 Premature operation C.4 Results C.5 Dielectric strength test |
| 31 | C.6 Test oven |
| 33 | Annex D (informative) Extended holding temperature evaluation D.1 Extended holding temperature conditioning test D.2 Load current interrupt test |
| 35 | Annex E (normative) Seal ageing test |
| 37 | Annex F (normative) Identification requirements |
| 38 | Annex G (normative) Indelibility of markings0F |
| 39 | Annex H (normative) Requirements for thermal-link packaged assemblies H.3 Terms and definitions H.4 General requirements H.5 General notes on tests H.9 Constructional requirements H.9.5 Insulating materials |
| 40 | H.9.9 Terminals and terminations |
| 41 | H.11. 101 Maximum use temperature test |
| 42 | Annex I (informative) Holding temperature |
| 43 | Bibliography |
