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BSI 22/30455890 DC 2022

BSI 22/30455890 DC 2022

$24.66

BS EN 16603-20-08. Space engineering. Photovoltaic assemblies and components

Published By Publication Date Number of Pages
BSI 2022 230
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PDF Catalog

PDF Pages PDF Title
16 1 Scope
17 2 Normative references
18 3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard
23 3.3 Abbreviated terms
26 3.4 Nomenclature
27 4 General
4.1 Overview
4.1.1 Objective and organization
29 4.1.2 Interfaces with other areas
30 4.2 Physical properties
4.3 Test and storage
4.3.1 Test environment
31 4.3.2 Test tolerances and accuracies
32 4.3.3
4.4 Critical materials
33 5 Photovoltaic assemblies
5.1 Overview
5.1.1 Description
5.1.2 Purpose and objective
34 5.2 Conditions and method of test
35 5.3 Photovoltaic assembly design
5.3.1 Overview
5.3.2 Parameters related to parts, materials and processes (PMP)
5.3.2.1 Outgassing
5.3.2.2 Toxicity
36 5.3.2.3 Flammability
5.3.2.4 Corrosion
5.3.2.5 Magnetism
5.3.2.6 Erosion
5.3.2.7 Atomic oxygen (ATOX)
5.3.3 Parameters related to design
5.3.3.1 Cell integration
37 5.3.3.2 Stringing
5.3.3.3 Cell interspacing
5.3.3.4 Sectioning
5.3.3.5 Reverse bias protection
5.3.3.6 Insulation
38 5.3.3.7 Derating
5.3.3.8 Redundancy
5.3.3.9 Fault tolerance
5.3.3.10 Fatigue resistance
39 5.3.3.11 Adherence to substrate
5.3.3.12 Adhesive uniformity
5.3.3.13 Electrostatic discharge (ESD)
5.3.3.14 Electromagnetic compatibility (EMC)
5.3.3.15 Repairability
40 5.4 PVA manufacturing
5.4.1 Process validation
5.4.2 Defect acceptability
5.4.3 In-process testing
5.4.3.1 Overview
5.4.3.2 Mass measurement
5.4.3.3 Wet insulation test
41 5.4.3.4 Adherence to substrate
5.4.3.5 Visual inspection
5.4.3.6 Continuity check
5.4.4 Identification and traceability
42 5.4.5 Recording
5.5 PVA tests
5.5.1 Qualification tests
5.5.1.1 Purpose
5.5.1.2 Process
43 5.5.1.3 Fatigue thermal cycling test
46 5.5.1.4 Humidity
47 5.5.1.5 Electrostatic discharge (ESD) test
49 5.5.1.6 Erosion of materials
50 5.5.1.7 EMC
5.5.2 Acceptance tests for qualification coupons
5.5.2.1 Purpose
5.5.2.2 Applicability
5.5.2.3 Deliverables
5.5.2.4 Process
51 5.5.3 Definition of tests and checks
5.5.3.1 Add-on mass measurement
5.5.3.2 Full visual inspection
56 5.5.3.3 Electrical health check
58 5.5.3.4 Electrical performance measurement
59 5.5.3.5 Capacitance test
5.5.3.6 Bake-out
60 5.5.3.7 Thermal cycling acceptance test
5.5.3.8 Reflectance
61 5.5.3.9 X-Ray
5.5.3.10 Substrate integrity
5.5.3.11 Vacuum thermal cycling
62 5.6 Failure definition
5.6.1 Failure criteria
63 5.6.2 Failed qualification coupons
5.7 Data documentation
5.8 Delivery
5.9 Packaging, packing, handling and storage
64 6 Solar cell assemblies
6.1 General
6.1.1 Testing
6.1.2 Conditions and methods of test
6.1.3 Deliverable components
6.1.4 Identification and traceability
65 6.2 Production control (process identification document)
6.3 Acceptance tests
6.3.1 General
6.3.2 Test methods and conditions
66 6.3.3 Electrical performance acceptance test (EPA)
6.3.3.1 Purpose
6.3.3.2 Process
6.3.3.3 Pass-fail criteria
6.4 Qualification tests
6.4.1 General
68 6.4.2 Qualification
6.4.2.1 Production and test schedule
6.4.2.2 Qualification test samples
69 6.4.2.3 Qualification testing
6.4.3 Test methods, conditions and measurements
6.4.3.1 Full visual inspection including ELM (VI)
72 6.4.3.2 Dimensions and weight (DW)
6.4.3.3 Electrical performance (EP)
73 6.4.3.4 Temperature coefficients (TC)
74 6.4.3.5 Spectral response (SR)
75 6.4.3.6 Thermo-optical data (TO)
76 6.4.3.7 Thermal cycling (CY)
6.4.3.8 Humidity and temperature (HT)
6.4.3.9 Coating adherence (CA)
77 6.4.3.10 Interconnector adherence (IA)
6.4.3.11 Electron irradiation (EI)
78 6.4.3.12 Photon irradiation and temperature annealing (PH)
79 6.4.3.13 Surface conductivity (SC)
6.4.3.14 Solar Cell Reverse Bias Test (RB)
6.4.3.15 Ultraviolet exposure test (UV)
81 6.4.3.16 Capacitance test (CT)
82 6.4.3.17 Flatness test (FT)
6.4.3.18 Long Duration – Life test (LT)
83 6.4.3.19 Angular Measurement (AM)
84 6.5 Failure definition
6.5.1 Failure criteria
6.5.2 Failed SCAs
6.6 Data documentation
85 6.7 Delivery
6.8 Packing, dispatching, handling and storage
6.8.1 Overview
6.8.2 ESD Sensitivity
86 7 Bare solar cells
7.1 Testing, deliverable components and marking
7.1.1 Testing
7.1.1.1 Tests for qualification and procurement
7.1.1.2 Conditions and methods of tests
7.1.1.3 Responsibility of supplier for the performance of tests and inspections
87 7.1.1.4 Preliminary characterization
7.1.2 Deliverable components
7.1.3 Marking
7.2 Production control (process identification document)
88 7.3 Acceptance tests
7.3.1 General
7.3.2 Test methods and conditions
7.3.2.1 Test other than electrical performance
89 7.3.2.2 Electrical performance
7.3.3 Documentation
90 7.4 Qualification tests
7.4.1 General
92 7.4.2 Qualification
7.4.2.1 Production and test schedule
7.4.2.2 Qualification test samples
7.4.2.3 Qualification testing
93 7.5 Test methods, conditions and measurements
7.5.1 Visual inspection including ELM (VI)
7.5.1.1 Applicability
7.5.1.2 Test process
7.5.1.3 Deviations
7.5.1.4 Solar cell defects
94 7.5.1.5 Solar cell contact area defects
95 7.5.2 Dimensions and weight (DW)
7.5.3 Electrical performance (EP)
7.5.3.1 Purpose
7.5.3.2 Process
96 7.5.4 Temperature coefficients (TC)
97 7.5.5 Spectral response (SR)
7.5.5.1 Purpose
7.5.5.2 Process
7.5.6 Optical properties (OP)
7.5.6.1 Overview
98 7.5.6.2 Hemispherical reflectance (HR)
7.5.6.3 Coverglass gain-loss (GL)
7.5.6.4 Solar absorptance (as)
7.5.7 Humidity and temperature (HT)
7.5.7.1 HT1 for qualification testing (subgroup O)
99 7.5.7.2 HT2 for qualification (subgroup A) and acceptance testing
7.5.8 Coating adherence (CA)
7.5.8.1 Purpose
7.5.8.2 Process
100 7.5.9 Contact uniformity (CU)
7.5.9.1 Purpose
7.5.9.2 Process
7.5.9.3 Pass fail criteria
7.5.10 Contact thickness (CT)
7.5.10.1 Purpose
7.5.10.2 Process
7.5.10.3 Pass fail criteria
101 7.5.11 Surface finish (SF)
7.5.11.1 Purpose
7.5.11.2 Process
7.5.11.3 Pass fail criteria
7.5.12 Pull test (PT)
7.5.12.1 Purpose
7.5.12.2 Process
7.5.13 Electron irradiation (EI)
7.5.13.1 Purpose
102 7.5.13.2 Process
103 7.5.14 Proton irradiation (PI)
7.5.14.1 Purpose
7.5.14.2 Process
104 7.5.15 Photon irradiation and temperature annealing (PH)
7.5.15.1 Purpose
7.5.15.2 Process
105 7.5.16 Solar cell reverse bias test (RB)
7.5.16.1 Purpose
7.5.16.2 Process
7.5.16.3 Pass-fail criteria
7.5.17 Thermal cycling (CY)
7.5.17.1 Purpose
7.5.17.2 Process
7.5.18 Active-passive interface evaluation test (IF)
7.5.18.1 Purpose
106 7.5.18.2 Process
7.5.19 Flatness test (FT)
7.5.19.1 Purpose
7.5.19.2 Process
7.5.19.3 Pass/fail criteria.
7.6 Failure definition
7.6.1 Failure criteria
7.6.2 Failed components
107 7.7 Data documentation
7.8 Delivery
7.9 Packing, dispatching, handling and storage
7.9.1 Overview
7.9.2 ESD Sensitivity
108 8 Coverglasses
8.1 Overview
8.1.1 Purpose
8.1.2 Description
8.2 Interfaces
8.3 Testing, deliverable components and marking
8.3.1 Testing
8.3.1.1 Tests for qualification and procurement
109 8.3.1.2 Conditions and methods of tests
8.3.1.3 Responsibility of supplier for the performance of tests and inspections
8.3.2 Deliverable components
8.3.3 Marking (coating orientation)
110 8.4 Production control (Process identification document)
8.5 Acceptance tests
8.5.1 Acceptance test samples
8.5.2 Acceptance test sequence
111 8.5.3 Test methods and conditions
8.5.4 Documentation
8.6 Qualification tests
8.6.1 General
112 8.6.2 Qualification
8.6.2.1 Production and test schedule
8.6.2.2 Qualification test samples
8.6.2.3 Qualification testing
114 8.7 Test methods, conditions and measurements
8.7.1 Visual inspection (VI)
8.7.1.1 General
8.7.1.2 Deviations
8.7.1.3 Defects
115 8.7.2 Transmission into air (TA)
116 8.7.3 Electro-optical properties (EO)
8.7.3.1 Bulk and surface resistivity
8.7.3.2 Refractive index
8.7.4 Mechanical properties
8.7.4.1 Dimension and weight
117 8.7.4.2 Density
8.7.4.3 Thickness
8.7.4.4 Edge parallelism
8.7.4.5 Perpendicularity of sides
8.7.5 Reflectance properties (OP)
8.7.5.1 Reflectance
8.7.5.2 Reflectance cut-on
118 8.7.5.3 Reflectance cut-off
8.7.5.4 Reflectance bandwidth
8.7.6 Normal emittance (eN) (NE)
8.7.7 Surface resistivity
119 8.7.8 Flatness or bow (FT)
8.7.9 Transmission into adhesive (TH)
120 8.7.10 Boiling water test (BW)
8.7.11 Humidity and temperature
8.7.11.1 HT1 for qualification testing (subgroup O)
8.7.11.2 HT2 for acceptance testing
121 8.7.12 UV exposure (UV)
8.7.12.1 Purpose
8.7.12.2 Process
8.7.13 Electron irradiation (EI)
8.7.13.1 Purpose
122 8.7.13.2 Process
8.7.14 Proton irradiation (PI)
8.7.14.1 Purpose
8.7.14.2 Process
8.7.15 Breaking strength (BS)
8.7.16 Thermal cycling (CY)
123 8.7.17 Abrasion resistance (coated surface) (AE)
8.7.18 Coating adhesion (TD)
8.8 Failure definition
8.8.1 Failure criteria
8.8.2 Failed components
124 8.9 Data documentation
8.10 Delivery
8.11 Packing, dispatching, handling and storage
125 9 Solar cell protection diodes
9.1 Overview
9.2 Testing, deliverable components and marking
9.2.1 Testing
9.2.1.1 Tests for qualification and procurement
126 9.2.1.2 Conditions and methods of tests
9.2.1.3 Responsibility of supplier for the performance of tests and inspections
9.2.2 Deliverable components
9.2.2.1 Integral protection diodes
127 9.2.2.2 External protection diodes
9.2.3 Marking
9.3 Production control (process identification document)
9.3.1 Integral protection diodes
9.3.2 External protection diodes
9.4 Acceptance tests
9.4.1 General
128 9.4.2 Integral protection diodes
9.4.3 External protection diodes
9.4.4 External and integral diodes
129 9.4.5 Test methods and conditions
9.4.5.1 Production and test schedule
9.4.5.2 Diode characterization for acceptance (DCA)
130 9.4.6 Documentation
9.5 Qualification tests
9.5.1 General
9.5.2 Integral protection diodes
131 9.5.3 External protection diodes
133 9.5.4 Integral and external protection diodes
9.5.4.1 Production and test schedule
9.5.4.2 Qualification test samples
134 9.5.4.3 Qualification testing
9.6 Test methods, conditions and measurements
9.6.1 General
9.6.2 Visual inspection (VI)
9.6.2.1 Applicability
9.6.2.2 Test process
135 9.6.2.3 Deviations
9.6.2.4 Protection diode defects
9.6.2.5 External protection diode contact area defects
9.6.3 Dimensions and weight (DW)
136 9.6.4 Thermal cycling (CY)
9.6.4.1 Purpose
9.6.4.2 Process
9.6.5 Burn in (BI)
9.6.5.1 Purpose
9.6.5.2 Process
137 9.6.6 Humidity and temperature (HT1)
9.6.6.1 Purpose
9.6.6.2 Process
9.6.7 Contact uniformity (CU)
9.6.7.1 Purpose
9.6.7.2 Process
9.6.7.3 Pass Fail Criteria
138 9.6.8 Contact thickness (CT)
9.6.8.1 Purpose
9.6.8.2 Process
9.6.8.3 Pass Fail Criteria
9.6.9 Surface Finish (SF)
9.6.9.1 Purpose
9.6.9.2 Process
9.6.9.3 Pass Fail Criteria
9.6.10 Contact adherence (CA)
9.6.10.1 Purpose
139 9.6.10.2 Process
9.6.11 Pull test (PT)
9.6.11.1 Purpose
9.6.11.2 Process
9.6.12 Electron irradiation (EI)
9.6.12.1 Purpose
140 9.6.12.2 Process
9.6.13 Temperature annealing (TA)
9.6.13.1 Purpose
9.6.13.2 Process
141 9.6.14 Temperature behaviour (TB)
9.6.14.1 Purpose
9.6.14.2 Process
9.6.15 Diode characterization (DC)
9.6.15.1 Purpose
9.6.15.2 Process
142 9.6.15.3 Pass-fail criteria
9.6.16 Human body ESD (DE)
9.6.16.1 Purpose
9.6.16.2 Process
143 9.6.16.3 Pass-fail criteria
9.6.17 Switching test (DS)
9.6.17.1 Purpose
9.6.17.2 Process
146 9.6.17.3 Pass-fail criteria
9.6.18 Long Duration – Life test (LT)
9.6.18.1 Purpose
147 9.6.18.2 Process
148 9.6.18.3 Pass-fail criteria
9.7 Failure definition
9.7.1 Failure criteria
149 9.7.2 Failed components
9.8 Data documentation
9.9 Delivery
150 9.10 Packing, despatching, handling and storage
9.10.1 Overview
9.10.2 ESD sensitivity
151 10 Solar simulators and calibration procedures
10.1 Solar simulators
10.1.1 Spectral distribution
10.1.1.1 AM0 spectrum
10.1.1.2 Total Irradiance of the Solar simulator
10.1.1.3 Spectral distribution of the Solar simulator
154 10.1.2 Irradiance uniformity
155 10.1.3 Irradiance stability
156 10.2 Standard cell and Solar simulator calibration
10.2.1 Primary standards
10.2.2 Secondary working standards (SWS)
10.2.2.1 Selection of secondary working standards
10.2.2.2 <>
10.2.2.3 Secondary working standards performance requirements
157 10.2.3 Standards cells documentation
158 10.2.4 Maintenance of standards
10.2.5 Recalibration and intercomparation
10.2.6 Solar simulator calibration and maintenance
10.2.6.1 Solar simulator calibration
159 10.2.6.2 Solar simulator maintenance
160 11 Capacitance measurement methods
11.1 Single junction solar cell capacitance measurement
11.1.1 Overview
11.1.1.1 Introduction
11.1.1.2 Description
11.1.2 Signal measurement method
161 11.1.3 Measurement procedure
11.1.3.1 Preparation of the measurement equipment
162 11.1.3.2 Process for calibration of the test equipment
165 11.1.3.3 Measurement of the cell with the network analyser
11.1.4 Measurement analysis
11.1.4.1 Correction of the measurement with respect to the actual impedance of the shunt (impedance values from the B/A measurements)
166 11.1.4.2 Modelling
168 11.1.5 Measurement of the capacitance of a multi-junction cell
169 11.2 Time domain capacitance measurement
11.2.1 Overview
11.2.1.1 Introduction
11.2.1.2 Description
11.2.2 Measurement procedure
11.2.2.1 Measurement equipment set-up
170 11.2.2.2 Calibration of the measurement equipment
11.2.2.3 Performance measurement
11.2.2.4 Data processing
171 12 Planar Blocking Diodes
12.1 Overview
12.2 Testing, deliverable components and Marking
12.2.1 Testing
12.2.1.1 Tests for qualification and procurement
12.2.1.2 Conditions and methods of tests
172 12.2.1.3 Responsibility of supplier for the performance of tests and inspections
12.2.2 Deliverable components
12.2.3 Marking
173 12.3 Production control (process identification document)
12.4 Acceptance test
12.4.1 General
12.4.2 Planar blocking diodes
174 12.5 Qualification tests
12.5.1 General
12.5.2 Blocking diodes
175 12.5.3 Production and test schedule
12.5.4 Qualification test samples
12.5.5 Qualification testing
178 12.6 Test methods, conditions and measurements
12.6.1 Visual inspection (VI)
12.6.1.1 Process
12.6.1.2 Deviations
12.6.1.3 Defects
12.6.2 Dimensions and weight (DW)
179 12.6.3 Diode characterization (DC)
12.6.3.1 Purpose
12.6.3.2 Process
12.6.3.3 Pass/fail criteria
12.6.4 Humidity and Temperature (HT1)
12.6.4.1 Purpose
12.6.4.2 Process
180 12.6.5 Temperature Cycling (CY)
12.6.5.1 Purpose
12.6.5.2 Process
12.6.6 Contact Adherence (CA)
12.6.6.1 Purpose
12.6.6.2 Process
181 12.6.6.3 Pass/fail criteria
12.6.7 Burn-in (BI)
12.6.7.1 Purpose
12.6.7.2 Power Burn-in (FWD-BI)
12.6.7.3 High Temperature Reverse Bias Burn-in (HTRB-BI)
182 12.6.8 Long duration-Life Test (LT)
12.6.8.1 Purpose
12.6.8.2 Process
12.6.8.3 Pass/fail criteria
12.6.9 Temperature behaviour test (TB)
12.6.9.1 Purpose
183 12.6.9.2 Process
12.6.10 Temperature robustness test
12.6.10.1 Purpose
12.6.10.2 Process
12.6.11 Total Dose Radiation Testing (RT)
12.6.11.1 Ionising radiation test
185 12.6.11.2 Non-ionising radiation test
12.6.12 Temperature Annealing (TA)
12.6.12.1 Purpose
186 12.6.12.2 Process
12.6.13 Contact uniformity test (CU)
12.6.13.1 Purpose
12.6.13.2 Process
12.6.13.3 Pass-fail criteria
12.6.14 Surface Finish test (SF)
12.6.14.1 Purpose
12.6.14.2 Process
12.6.14.3 Pass-fail criteria
12.6.15 Human Body ESD test (ESD)
12.6.15.1 Purpose
187 12.6.15.2 Process
12.6.15.3 Pass-fail criteria
12.6.16 Pull test (PT) / Interconnector adherence test (IA)
12.6.16.1 Purpose
12.6.16.2 Process
12.6.16.3 Pass-fail criteria
12.6.17 Surge test (ST)
12.6.17.1 Purpose
12.6.17.2 Process
188 12.6.17.3 Pass-Fail criteria
12.6.18 Thermo-optical data (TO)
12.6.18.1 Purpose
12.6.18.2 Process
12.6.18.3 Pass-fail criteria
12.7 Failure definition
12.7.1 Failure criteria
189 12.7.2 Failed Blocking Diodes
12.8 Data documentation
12.9 Delivery
12.10 Packing, despatching, handling and storage
12.10.1 Overview
12.10.2 ESD sensitivity

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