BSI PD IEC TR 62878-2-8:2021

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Device embedding assembly technology – Guidelines. Warpage control of active device embedded substrate

Published By	Publication Date	Number of Pages
BSI	2021	18

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This part of IEC 62878 describes a warpage control of active device embedded substrate along with parameters for determining warpage, which are useful during package assembly. Warpage results are explained using warpage driving force, resistance and neutral axis, for typical die embedded substrate, where the discrete active dies are placed in the core of substrate and interconnected to the substrate by direct Cu bonding. The same principles are applicable in other device embedded substrates. Even though the detailed structure of other device embedded substrates might be different, the origin and determination of the parameters of warpage are the same and thus the purpose of this report is to help engineers improve the warpage behaviours of their products by applying this principle.

PDF Catalog

PDF Pages	PDF Title
2	undefined
4	CONTENTS
5	FOREWORD
7	1 Scope 2 Normative references 3 Terms and definitions
8	4 Warpage driving force and resistance 4.1 General 4.2 Warpage driving force 4.3 Warpage resistance Figures Figure 1 – Warpage behaviour of device embedded substrate during heating and cooling
9	4.4 Determining parameters Figure 2 – Relationship between warpage and rigidity Figure 3 – Parameters determining warpage
10	Figure 4 – Effects of dummy Cu design on warpage
11	5 Guideline for warpage of active device embedded substrate 5.1 General 5.2 Rigidity 5.3 Neutral axis Figure 5 – Neutral axis of device embedded substrate
12	5.4 Typical example of low rigidity case Figure 6 – Warpage behaviour of active device embedded substrate during heating and cooling
13	5.5 Typical example of high rigidity case Figure 7 – Measured and simulated warpage results of die embedded substrates with low rigidity
14	Figure 8 – Structure of die embedded package with high rigidity Figure 9 – Simulated results on effect of die thickness on die embedded package warpage
15	6 Conclusion
16	Bibliography