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DIN EN IEC 61189-5-301:2020 Edition

DIN EN IEC 61189-5-301:2020 Edition

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: Test methods for printed board assemblies – Soldering paste using fine solder particles (Draft)

Published By Publication Date Number of Pages
DIN 2020-12 64
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This International Standard specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This International Standard is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e. g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which may affect the test result by existing test methods.

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DIN EN IEC 61189-5-301
$37.05