DIN EN IEC 62878-2-602:2020 Edition
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Device Embedding Assembly Technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity (Draft)
Published By | Publication Date | Number of Pages |
DIN | 2020-11 | 20 |
This document specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic module.