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IEEE 1573 2004

$61.75

IEEE Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance

Published By Publication Date Number of Pages
IEEE 2004 124
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New IEEE Standard – Active. A technical basis for implementation of electronic power subsystems is provided in this recommended practice. It is intended for electronic systems engineers and integrators, electronic power subsystem designers and integrators, as well as power element manufacturers and suppliers. It addresses system-level issues in element or subsystem integration, adaptation, and accommodation. It also defines system-level interface parameters, test methods, and test conditions. It provides for a systems engineering approach to acquisition, adaptation, and integration of electronic power subsystems, facilitates and promotes a modular approach to element or subsystem integration, and enables effective communication between the end users of power electronics and their manufacturers or suppliers.

PDF Catalog

PDF Pages PDF Title
1 Cover
2 IEEE Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance
Introduction
5 Participants
6 Contents
7 1. Overview
10 1.1 Scope
1.2 Purpose
11 1.3 Organization of this recommended practice
2. References
12 3. Definitions, abbreviations, acronyms, and symbols
3.1 Definitions
3.2 Abbreviations, acronyms, and symbols
14 4. Element-level parameters
16 4.1 Set point voltage accuracy
4.2 Maximum power dissipation
4.3 Contact resistance
4.4 Input undervoltage protection
4.5 Input overvoltage protection
17 4.6 Overtemperature shutdown
18 4.7 Reverse voltage protection
19 4.8 Turn-on time
20 4.9 Regulation, combined
21 4.10 Regulation effects due to aging
4.11 Lightning
4.12 Surge
4.13 Sag
5. Electronic power subsystems
22 5.1 Interface definition
5.2 Requirements definition
25 5.3 Architectural considerations
26 5.4 System interaction
31 6. Electrical interface parameters
32 6.1 Status monitoring
33 6.2 Supervisory control
6.3 Built-in-test
6.4 Electromagnetic compatibility/electromagnetic interference
7. Mechanical interface parameters
36 7.1 Packaging
37 7.2 Center of gravity
38 7.3 Cooling or thermal energy dissipation process
39 8. Environmental interface parameters
40 8.1 Thermal
41 8.2 Resistance to contaminants
8.3 Sand and dust
8.4 Explosive atmosphere
42 8.5 Acoustics
43 8.6 Radiation
44 9. System effectiveness interface parameters
46 9.1 Qualification requirements
9.2 Quality assurance
47 9.3 Acceptance testing
9.4 Compliance information
48 9.5 Logistics
9.6 Configuration management
49 9.7 Obsolescence
9.8 Discontinuance
9.9 Production line certification
9.10 Warranty
10. System integration
50 10.1 System interaction
10.2 Protection and sensing
54 10.3 Output sequencing and clamping
56 10.4 Supervisory/status monitoring, control, and software implementation
57 10.5 System reliability
58 10.6 Logistics
61 11. System adaptation
62 11.1 Electrical interface adaptations
70 11.2 Mechanical interface adaptation
80 11.3 Environmental interface adaptation
82 11.4 System effectiveness interface adaptation
89 11.5 Adaptation analysis techniques
94 Annex A—(informative) Bibliography
95 Annex B—(informative) Performance
98 Annex C—(informative) Parameter index
101 B.1. Electrical interface performance
B.2. Mechanical interface performance
103 B.3. Environmental interface performance
B.4. System effectiveness performance
112 Annex D (informative)—Radiation environments
113 D.1. Radiation environmental/definition
D.2. Definition of terms
D.3. Radiation environments
120 D.4. Radiation design considerations
123 D.5. Radiation testing
IEEE 1573 2004
$61.75