| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 54<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
| 58<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 60<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 61<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Determination of an envelope reflow profile 4.1 Temperature-time-envelope curve <\/td>\n<\/tr>\n | ||||||
| 62<\/td>\n | 4.2 Diagram of a theoretical envelope reflow profile 4.3 Key parameters of the envelope reflow profile Figures Figure 1 \u2013 Schematic envelope reflow profile Tables Table 1 \u2013 Temperature-time curve \u2013 Units <\/td>\n<\/tr>\n | ||||||
| 63<\/td>\n | Table 2 \u2013 Envelope points of a reflow temperature-time-profile <\/td>\n<\/tr>\n | ||||||
| 65<\/td>\n | 5 Temperature profile measurements 5.1 Determining the measurement locations <\/td>\n<\/tr>\n | ||||||
| 66<\/td>\n | 5.2 Selection and attachment of thermocouples 5.2.1 Types of thermocouples Figure 2 \u2013 Recommended temperature measurement locations on a test board Figure 3 \u2013 X-ray of a sheath thermocouple <\/td>\n<\/tr>\n | ||||||
| 67<\/td>\n | 5.2.2 Preparation of thermocouples 5.2.3 Attachment of thermocouples Figure 4 \u2013 Example of a) acceptable and b) unacceptable attachment of the thermocouples <\/td>\n<\/tr>\n | ||||||
| 68<\/td>\n | Table 3 \u2013 Thermocouple attachment methods <\/td>\n<\/tr>\n | ||||||
| 69<\/td>\n | Figure 5 \u2013 Examples of good and bad thermocouple attachment <\/td>\n<\/tr>\n | ||||||
| 70<\/td>\n | 5.2.4 Influence of attachment method and operator on measurement results 5.3 Temperature gradient 5.3.1 Gradient calculation Figure 6 \u2013 Thermocouples (TC) fixed to an LED Figure 7 \u2013 Results of the same test board prepared by different methods <\/td>\n<\/tr>\n | ||||||
| 71<\/td>\n | Figure 8 \u2013 Gradient calculation <\/td>\n<\/tr>\n | ||||||
| 72<\/td>\n | 5.3.2 Sampling rate 5.4 Analysis, comparison and overlay of different reflow profiles and best practice Figure 9 \u2013 Example of a gradient calculation on a temperature-time curve <\/td>\n<\/tr>\n | ||||||
| 73<\/td>\n | 5.5 Measuring equipment 6 Tolerance analysis of the measurement chain Figure 10 \u2013 Overlay of different reflow profiles (origin at oven entry) Figure 11 \u2013 Overlay of different reflow profiles (overlap at start of peak zone) <\/td>\n<\/tr>\n | ||||||
| 74<\/td>\n | Figure 12 \u2013 Measurement chain Table 4 \u2013 Tolerances of the temperature measurement chain <\/td>\n<\/tr>\n | ||||||
| 75<\/td>\n | 7 Optimizing a temperature profile 7.1 General procedure 7.2 Description of a typical test board and the used reflow oven <\/td>\n<\/tr>\n | ||||||
| 76<\/td>\n | 7.3 Schematic envelope reflow profile for the example board Figure 13 \u2013 Description of a test board (electronic assembly) <\/td>\n<\/tr>\n | ||||||
| 77<\/td>\n | Table 5 \u2013 Envelope points at the envelope reflow profile for the test board <\/td>\n<\/tr>\n | ||||||
| 78<\/td>\n | 7.4 Preparation of test board Figure 14 \u2013 Envelope reflow profile for the test board Figure 15 \u2013 Thermal images of the test board after cooling down from 150 \u00b0C <\/td>\n<\/tr>\n | ||||||
| 79<\/td>\n | 7.5 Possibility of temperature profiling optimization with simulation tools Table 6 \u2013 Measurement locations on the sample assembly <\/td>\n<\/tr>\n | ||||||
| 80<\/td>\n | Figure 16 \u2013 Geometric and thermal description of the test board Figure 17 \u2013 Geometric and thermal description of the reflow soldering equipment <\/td>\n<\/tr>\n | ||||||
| 81<\/td>\n | 7.6 Iteration steps for finding reflow equipment setup Figure 18 \u2013 Predicted reflow profile with help of simulation (blue band) <\/td>\n<\/tr>\n | ||||||
| 82<\/td>\n | Table 7 \u2013 Settings according to experience Table 8 \u2013 Measurement results for the settings from Table 7 Table 9 \u2013 Settings for second run Table 10 \u2013 Measurement results for the settings from Table 9 <\/td>\n<\/tr>\n | ||||||
| 83<\/td>\n | Figure 19 \u2013 Overlay envelope curves of the temperature-time curvesof three profiling steps, 0201-chip solder joint Table 11 \u2013 Settings after adjustment of the heating zone temperatures Table 12 \u2013 Measurement results from Table 11, adaptation of heating zone temperatures <\/td>\n<\/tr>\n | ||||||
| 84<\/td>\n | 8 Examples of envelope reflow profiles 8.1 Key data for two different solders Figure 20 \u2013 Overlay envelope curves of the temperature-time curvesof three profiling steps, ERU25 solder joint <\/td>\n<\/tr>\n | ||||||
| 85<\/td>\n | 8.2 Example of a qualification temperature profile for component used in lead-free reflow soldering (SAC) Table 13 \u2013 Examples for envelope reflow profile key data for two different solders <\/td>\n<\/tr>\n | ||||||
| 86<\/td>\n | Figure 21 \u2013 Exemplary qualification reflow temperature profile for the qualification of components intended for use in assemblies with a wide variation of thermal masses Table 14 \u2013 Key parameters for a lead-free SAC reflowtemperature profile for component qualification <\/td>\n<\/tr>\n | ||||||
| 87<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Environmental testing – Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile<\/b><\/p>\n |